Advanced Technology Facilities

Semiconductor

300 mm wafer fab
Project
Description:

300mm wafer foundry

Locations:
Beijing, China
Duration:
2013 - 2018
Scope of M+W:
EPC contractor for cleanroom package and process exhaust systems
Key Features
  • Technology: Minimum feature size 28nm
  • Cleanroom classes: ISO 5 & 6 (Class 100 & 1,000)
  • Gross fab building area: 110,000 m2
  • B2B 6K cleanroom: 14,000 m2
  • B2A cleanroom:  30,000 m2